EC5645ETTTS-16.000M TR

EC56 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.0mm x 2.5mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1MHz to 50.625MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration ±100ppm Maximum ±20ppm Maximum ±25ppm Maximum ±50ppm Maximum -10°C to +70°C -40°C to +85°C 3.3Vdc ±10% Operating Temperature Range Supply Voltage Input Current Load Drive Capability 6mA Maximum over Nominal Frequency of 1MHz to 19.999999MHz 7mA Maximum over Nominal Frequency of 20MHz to 39.999999MHz 8mA Maximum over Nominal Frequency of 40MHz to 50.625MHz IOH = -4mA 90% of Vdd Minimum IOL = +4mA 10% of Vdd Maximum Measured at 20% to 80% of waveform 10nSec Maximum Measured at 50% of waveform 50 ±10(%) 50 ±5(%) 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) Standby Current Start Up Time 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High Impedance) Disabled Output: High Impedance 10µA Maximum 12kHz to 20MHz offset frequency 1pSec Maximum 10mSec Maximum Storage Temperature Range -55°C to +125°C Output Voltage Logic High (VOh) Output Voltage Logic Low (VOl) Rise/Fall Time Duty Cycle RMS Phase Jitter Revised G: 4/2/2015 Page 2 of 12 www.ecliptek.com EC56 Series PART NUMBERING GUIDE Revised G: 4/2/2015 Page 3 of 12 www.ecliptek.com EC56 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised G: 4/2/2015 Page 4 of 12 www.ecliptek.com EC56 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised G: 4/2/2015 Page 5 of 12 www.ecliptek.com EC56 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency capacitor close (less than 2mm) to the Package ground and supply voltage pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) Passive probe is recommended. Note 3: Capacitance value (CL) includes sum of all probe and fixture capacitance. Revised G: 4/2/2015 Page 6 of 12 www.ecliptek.com EC56 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised G: 4/2/2015 Page 7 of 12 www.ecliptek.com EC56 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised G: 4/2/2015 Page 8 of 12 www.ecliptek.com EC56 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised G: 4/2/2015 Page 9 of 12 www.ecliptek.com